Rapid Transfer of Electronic Components or either discontinued part or shortage products, we can respond to customers’ needs within 24 hours.
Provide booking services from agents all over the world, and help customers getting the best price for production through our system.
Help customers solve slow-moving inventory, and find buyers through the system quickly so as to reduce the inventory pressure and marketing cost.
Collect offer from agents/factories all over the world, input into our system, compare it with customers’ needs, and give feedback to customers immediately whenever a better price is quoted so as to help customers continuously getting cost down solution.
Through the collected information of our system, we assist customers in analyzing purchasing cost of parts currently being used on production. Besides, we will sort out these parts in good price/general price/bad price and keep tracing the general/bad price until customers achieve cost down goal.
Quality Inspection
For all the parts supplied to our customers, they can’t be shipped before inspection one by one
There are 3 kinds of inspection items in total: outer box, inner box, inside package and product.
Outer box & Inner box:
1. Whether it is complete or not
2. Whether it has original factory label or not
3. Whether part number/quantity/font size, LOGO, color and font arrangement of label marking are consistent with those of the original factory marking or not.
4. The bar code scanning
Inside package:
1. Whether the package is complete or not.
2. Whether part number/quantity/lot of label marking are correct or not.
3. The bar code scanning
4. Whether it is the original factory inside package (reel/tube/tray) or not.
Product:
1. Whether the size is consistent with the specification recorded in datasheet or not.
2. Whether marking is consistent with datasheet or not.
3. Whether lead & lead-free marking is correct or not.
4. Whether the D/C and LOT marking are correct and consistent or not
5. Whether de-painting and inconsistent depth exist in marking or not.
6. Whether the shapes of PIN/solder ball are consistent with those of datasheet or not.
7. Whether oxidation, PIN bending, deformation, scratch and re-soldering are found in PIN/solder ball or not.
8. Whether materials, colors, backing glue and gold wire configurations on front side and back side of IC are consistent or not.
Line Card
